TechCoherent sampling 300mm SiC for AI HPC
Coherent Corp has begun customer sampling of 300‑mm high‑thermal‑conductivity silicon carbide substrates for AI and HPC applications, signaling a shift from internal development to customer evaluation and targeting AI infrastructure providers. The move highlights vertical integration across SiC production and potential heat‑spreading improvements over current solutions to enable higher power densities and better thermal management in next‑generation AI systems.
