Wire bonding

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz. Materials Bondwires usually consist of one of the following materials: Aluminium Copper Silver Gold Wire diameters start from under 10 μm and can be up to several hundred micrometres for high-powered applications.