WEISUN Adds 310mm Chamber for FOPLP Ovens

WEISUN Industrial has introduced a dedicated 310 x 310mm chamber in its AQWOL-5S Smart Clean Room and Inert Gas Oven for OSAT and FOPLP lines, optimizing for single-panel formats and enabling 25 panels per cassette. The smaller chamber reduces gas purge requirements and thermal mass, with 8-zone damper control (vs 28 zones in the larger chamber) and a temperature uniformity of ±3°C, which aims to improve panel yield by mitigating warpage and alignment issues that scale with panel area. The oven operates from room temperature to 200°C in a Class 100 clean environment, maintaining in-chamber oxygen below 50ppm to protect substrates during processing, while standard configurations offer ±1.5% temperature uniformity. It supports steel carriers up to 700 x 700mm (4mm thick, 15kg per sheet) and glass panels from 310 x 310mm to 700 x 700mm on various racks, with cooling options including air cooling with N2 or CDA or water cooling, plus rapid air-cooling as an option. WEISUN’s W-AIMS software can monitor airflow, filtration, chamber airtightness, damper behavior, and ventilation efficiency, delivering ML-based maintenance recommendations. This development underscores a push to enhance FOPLP processing yields by aligning oven performance with panel-level packaging demands.